Optical-semiconductor device and method for manufacturing the same

ABSTRACT

A method for manufacturing an optical-semiconductor device, including forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin; and obtaining individual optical-semiconductor devices after removing the support substrate.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an optical-semiconductor deviceincluding a light emitting device that can be used in display apparatus,illumination apparatus, backlight source for liquid crystal display andthe like, and a light receiving device that can be used in video camera,digital still camera and the like, and a method for manufacturing thesame. In particular, the present invention relates to a thin or compactoptical-semiconductor device that has a high light-extraction efficiencyand high contrast and can be manufactured with high yield, and a methodfor manufacturing the same.

2. Description of the Related Art

As electronics apparatuses become more compact and light-weight inrecent years, efforts have also been made on optical-semiconductordevices such as light emitting device (light emitting diode, etc.) andlight receiving device (CCD, photodiode, etc.) that are mounted on theelectronics apparatuses, thereby developing compact ones. Theseoptical-semiconductor devices comprise, for example, a double-sidemounting printed circuit board with through holes that is made byforming metal circuit patterns on both sides of an insulating board. Anoptical-semiconductor elements such as light emitting element or lightreceiving element are mounted on the double-side mounting printedcircuit board with through holes, and the optical-semiconductor elementsare connected to the circuit pattern for electrical connection by usingwires.

However, it is imperative for the optical-semiconductor device to usethe double-side mounting printed circuit board with through holes. Sincethe double-side mounting printed circuit board with through holes hasthickness of about 0.1 mm or more, it makes an obstacle to the effort ofmaking a surface-mounted type optical-semiconductor device thinner.

For this reason, optical-semiconductor devices that do not use such aprinted circuit board have been developed (refer to, for example,Japanese Unexamined Patent Publication (Kokai) No. 2005-79329).

The light emitting device disclosed in Japanese Unexamined PatentPublication (Kokai) No. 2005-79329 is made thinner than the conventionalsurface-mounted type light emitting device, by sealing electrodes thatare formed from thin metal film by vapor deposition or the like on asubstrate, together with light emitting element by means of atranslucent resin.

However, since only the translucent resin is used, light-extractionefficiency is likely to decrease as light escapes from the lightemitting element through the bottom surface. A structure of cone-shapedmetal film for reflecting light has been proposed, although providingsuch a metal film makes it necessary to form pits in the surface of thesubstrate. Since the light emitting device is small in size, the pitsmust be very small and are difficult to form. In addition, because thestructure has the pits, light emitting device is prone to breakage whenthe substrate is peeled off from the device, which leads to a loweryield of production and other problems. Also when the light emittingdevice is used in a display or the like, use of the translucent resinonly tends to cause lower contrast.

SUMMARY OF THE INVENTION

In order to solve the problems described above, the method formanufacturing the optical-semiconductor device of the present inventioncomprises: (a)forming a plurality of first and second electricallyconductive members that are disposed separately from each other on asupport substrate; (b) providing a base member formed from a lightblocking resin between the first and second electrically conductivemembers; (c) mounting an optical-semiconductor element on the firstand/or second electrically conductive member; (d) covering theoptical-semiconductor element by a sealing member formed from atranslucent resin; and (e) obtaining individual optical-semiconductordevices after removing the support substrate. This method makes itpossible to easily manufacture the thin optical-semiconductor devicethat has high light-extraction efficiency.

An optical-semiconductor device of the present invention comprises: anoptical-semiconductor element; a first electrically conductive memberhaving a top surface whereon the optical-semiconductor element ismounted and a bottom surface that constitutes the external surface ofthe optical-semiconductor device; a second electrically conductivemember that is separated from the first electrically conductive memberand has a bottom surface that constitutes the external surface of theoptical-semiconductor device; a base member having a light blockingresin and is disposed between the first electrically conductive memberand the second electrically conductive member; and a sealing memberhaving a translucent resin and covers the optical-semiconductor element,wherein the first and second electrically conductive members are formedby plating. This constitution enables it to make a thinoptical-semiconductor device.

The present invention makes it possible to easily produce the thinoptical-semiconductor device with a high yield. Also because lightemitted by the light emitting element can be prevented from leakingthrough the bottom surface even in the thin optical-semiconductordevice, it is made possible to obtain an optical-semiconductor devicehaving improved light-extraction efficiency and an optical-semiconductordevice having improved contrast.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A is a perspective view showing the exterior and interiorstructure of the optical-semiconductor device of the present invention.

FIG. 1B shows a sectional view taken along lines A-A′ of theoptical-semiconductor device shown in FIG. 1A and an enlarged view of apart thereof.

FIG. 2A through 2H are a process diagram explanatory of a method formanufacturing the optical-semiconductor device of the present invention.

FIG. 3A is a perspective view showing the exterior and interiorstructure of the optical-semiconductor device of the present invention.

FIG. 3B shows a sectional view taken along lines B-B′ of theoptical-semiconductor device shown in FIG. 3A.

FIG. 4A through 4D are a process diagram explanatory of a method formanufacturing the optical-semiconductor device of the present invention.

FIG. 5 is a perspective view showing the exterior and interior structureof the optical-semiconductor device of the present invention.

FIG. 6A is a perspective view showing the optical-semiconductor deviceof the present invention.

FIG. 6B shows a sectional view taken along lines C-C′ of theoptical-semiconductor device shown in FIG. 6A.

FIG. 7A is a sectional view of the optical-semiconductor device of thepresent invention.

FIG. 7B is an enlarged sectional view of a part of theoptical-semiconductor device shown in FIG. 7A.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention will be described by makingreference to the accompanying drawings. It should be understood,however, that the embodiments described below are mere exemplificationof the optical-semiconductor device of the present invention and amethod for manufacturing the same, and are not intended to restrict thepresent invention.

This specification does not restrict the members described in the claimsto those described in the embodiments. Dimensions, materials, shapes andrelative positions of the components described in the embodiments, inparticular, are mere examples that do not define the scope of thepresent invention, unless specifically restrictive statement is given.Dimensions and positional relationship of the components may beexaggerated in the drawings for the purpose of making it easier tounderstand. Further in the description that follows, an identical nameor identical reference numeral represents the same or similar component,and detailed description thereof will be omitted.

Embodiment 1

An optical-semiconductor device (light emitting device) 100 of thisembodiment is shown in FIG. 1A and FIG. 1B. FIG. 1A is a perspectiveview of the light emitting device 100. FIG. 1B is a sectional view takenalong lines A-A′ of the light emitting device 100 shown in FIG. 1A.

In this embodiment, the light emitting device 100 comprises a lightemitting element 103, first electrically conductive members 101, 101′that are electrically connected to the light emitting element 103, asecond electrically conductive member 102 that is disposed separatelyfrom the first electrically conductive members 101, 101′ and has thelight emitting element 103 mounted thereon, and a sealing member 104that covers the light emitting element 103 and makes contact with thefirst electrically conductive members 101, 101′ and the secondelectrically conductive member 102 as shown in FIG. 1A and FIG. 1B. Inaddition, a base member 106 formed from a resin capable of blocking thelight emitted by the light emitting element 103 is provided between thefirst electrically conductive members 101, 101′ and the secondelectrically conductive member 102.

(Base Member 106)

In this embodiment, the base member 106 is formed from a resin capableof blocking the light emitted by the light emitting element 103 byadding a light blocking filler or the like, and is provided between thefirst electrically conductive members 101, 101′ and the secondelectrically conductive member 102. Providing the light blocking basemember 106 at this position makes it possible to prevent the lightemitted by the light emitting element 103 from leaking through thebottom surface of the light emitting device 100 to the outside, andimprove the light-extraction efficiency in the direction upward.

Thickness of the base member 106 may be such that can prevent the lightfrom leaking through the bottom surface of the light emitting device100. The base member 106 is preferably disposed so as to contact boththe side faces of the first electrically conductive members 101, 101′and the side face of the second electrically conductive member 102, inother words, so that the sealing member 104 does not exist between thefirst electrically conductive members 101, 101′ and the base member 106,or between the second electrically conductive member 102 and the basemember 106.

In case the first electrically conductive member 101, 101′ or the secondelectrically conductive member 102 has a width that is different fromthe width of the light emitting device 100, for example, width of thefirst electrically conductive member 101, 101′ is smaller than the widthof the light emitting device 100 and the side faces of the firstelectrically conductive member 101, 101′ and the side face of the lightemitting device 100 are located apart from each other, then the basemember may be provided also at this position as shown in FIG. 1A. Withthis constitution, the bottom surface of the light emitting device 100is constituted from the first electrically conductive members 101, 101′,the base member 106 and the second electrically conductive member 102,and therefore light can be effectively prevented from leaking throughthe bottom surface.

The base member 106 may be formed from any material as long as it canblock the light emitted by the light emitting element. It is preferable,however, to use a material that has linear expansion coefficientproximate to that of the support substrate with small difference. It ismore preferable to use an insulating material, such as thermosettingresin or thermoplastic resin. In case the electrically conductive memberhas a very small thickness such as 25 μm to 200 μm, in particular, it ispreferable to use a thermosetting resin that allows it to form anextremely thin base member. Specifically, (a) an epoxy resincomposition, (b) a silicone resin composition, (c) a modified epoxyresin composition such as a silicone-modified epoxy resin, (d) amodified silicone resin composition such as an epoxy-modified siliconeresin, (e) polyimide resin composition and (f) a modified polyimideresin composition may be used.

A thermosetting resin, particularly a resin described in JapaneseUnexamined Patent Publication (Kokai) No. 2006-156704 or U.S. patentapplication Ser. No. 12/162,974 (published as US2009-50925) ispreferably used. The contents of them (JP2006-156704 and U.S. patentapplication Ser. No. 12/162,974) are incorporated herein as reference.Among the thermosetting resins, for example, an epoxy resin, a modifiedepoxy resin, a silicone resin, a modified silicone resin, an acrylateresin, a urethane resin and the like are preferably used. Morespecifically, it is preferable to use a solid epoxy resin compositionthat contains a colorless and transparent mixture prepared by mixing anddissolving (i) an epoxy resin composed of triglycidyl isocyanurate andhydrogenated bisphenol A triglycidyl ether and (ii) an acid anhydridecomposed of hexahydrophthalic anhydride, 3-methyl-hexahydrophthalicanhydride and 4-methyl-hexahydrophthalic anhydride, to be anequivalence. Further it is preferable to use a solid epoxy resincomposition that has been turned into B stage by adding 0.5 parts byweight of DBU (1,8-diazabicyclo(5,4,0)undecene-7) as a curingaccelerator, 1 part by weight of ethylene glycol as an auxiliarycatalyst, 10 parts by weight of a titanium oxide pigment and 50 parts byweight of a glass fiber to 100 parts by weight of the mixture describedabove, and heating so as to accelerate the reaction to partially cure.

It is also preferable to use a thermosetting epoxy resin composition ofwhich essential component is an epoxy resin that contains a triazinederivative epoxy resin described in International Publication No. WO2007/015426 or U.S. patent application Ser. No. 11/997,734, the contentof which is incorporated herein as reference For example, it ispreferable to include a 1,3,5-triazine derivative epoxy resin. An epoxyresin having an isocyanurate ring, in particular, has high resistance tolight and high electric insulating property. It is desirable that theresin has a divalent, more preferably trivalent epoxy group for oneisocyanurate ring. Specifically, tris(2,3-epoxypropyl) isocyanurate,tris(α-methylglycidyl)isocyanurate or the like may be used. It ispreferable that the triazine derivative epoxy resin has a softeningpoint in a range from 90 to 125° C. The triazine derivative epoxy resinmay also be used together with a hydrogenated epoxy resin or other epoxyresins. In case a silicone resin composition is used, a silicone resinthat contains a methyl-silicone resin is preferably used.

A case of using triazine derivative epoxy resin will be specificallydescribed. It is preferable to use an acid anhydride that acts as acuring agent on the triazine derivative epoxy resin. Light resistivitycan be improved, in particular, by using an acid anhydride that is notan aromatic compound and does not include carbon-carbon double bond.Specifically, hexahydrophthalic anhydride, methyl-hexahydrophthalicanhydride, trialkyltetrahydrophthalic anhydride, hydrogenatedmethylnadic anhydride and the like may be used. Among these,methylhexahydrophthalic anhydride is particularly preferably used. It isalso preferable to use an antioxidant, such as those based on phenol orsulfur. For the curing catalyst, those known as the curing catalyst foran epoxy resin composition may be used.

A filler that enhances light-blocking effect and, if required, variousadditives may be added to these resins. The resins together with theseadditives will be referred to as a light blocking resin, whichconstitutes the base member 106. Permeability to light can be controlledby mixing fine particles of TiO₂, SiO₂, Al₂O₃, MgO, MgCO₃, CaCO₃,Mg(OH)₂, Ca(OH)₂ or the like as the filler. It is preferable to blockabout 60% of the light from the light emitting element, more preferablyabout 90% or more. The base member 106 may either reflect or absorb thelight. In case the optical-semiconductor device is used for such anapplication as illumination, it is preferable to block light byreflection rather than by absorption. In this case, it is preferable toreflect about 60% or more of the light from the light emitting element,more preferably about 90% or more.

The filler materials listed above may be used individually or in acombination of two or more kinds. For example, a filler that regulatesthe reflectivity and a filler that regulates the linear expansioncoefficient to be described later may be used together. In case TiO₂ isused as a filler of white color, it is preferably added in proportion of10 to 30 wt %, more preferably 15 to 25 wt %. TiO₂ of either rutile typeor anatase type may be used, while rutile type is preferably used forthe reason of light blocking property and resistance to light. When itis desired to improve dispersing characteristic and resistance to light,a filler that has been modified through surface treatment may also beused. Oxide hydrate or oxide such as alumina, silica, zinc oxide may beused in the surface treatment of the filler consisting of TiO₂. Inaddition to these, it is preferable to add 60 to 80 wt %, morepreferably 65 to 75 wt % of SiO₂ as a filler. It is preferable to useamorphous silica, that has lower linear expansion coefficient, ratherthan crystalline silica. The particle size of the filler is preferably100 μm or less, and more preferably 60 μm or less. Further, particleshape of the filler is preferably spherical, which makes it possible toimprove the filling performance of the filler when molding the basemember. When it is desired to improve contrast in an application fordisplay or the like, a filler that absorbs 60% or more of the lightemitted by the light emitting element, more preferably 90% or more ofthe light is preferably used. In this case, (a) carbon such as acetyleneblack, activated carbon or graphite, (b) oxide of transition metal suchas iron oxide, manganese dioxide, cobalt oxide or molybdenum oxide, or(c) organic pigment may be used in accordance to the purpose.

It is preferable to control the linear expansion coefficient of the basemember so that it has smaller difference from the linear expansioncoefficient of the support substrate that is removed before dividinginto individual devices. The liner expansion coefficient of the basemember is preferably 0.5 to 2 times as large as the liner expansioncoefficient of the support substrate. The difference between the linearexpansion coefficient of the base member and that of the supportsubstrate is preferably 30% or less, and more preferably 10% or less. Incase the support substrate is formed from SUS, the difference in linearexpansion coefficient is preferably 20 ppm or less, and more preferably10 ppm or less. In this case, it is preferable to add 70 wt % or more,and more preferably 85 wt % or more filler, which makes it possible tocontrol (relax) the residual stress in the support substrate and thebase member, so that the combined array of the optical-semiconductorsbefore being divided into individual devices can be suppressed fromwarping. As warping is reduced, damages caused inside such as breakageof electrically conductive wires can be decreased and positional errorcan be suppressed from occurring when dividing into individual devices,which improves the yield of production. Linear expansion coefficient ofthe base member is preferably controlled within a range from 5 to25×10⁻⁶/K, more preferably from 7 to 15×10⁻⁶/K, which makes it easier tosuppress warping from taking place when the base member is cooled downafter being molded, thus making it possible to manufacture with highyield. In this specification, the linear expansion coefficient refers tothe linear expansion coefficient of the base member, that may be formedfrom the light blocking resin prepared with various fillers addedthereto, at a temperature below the glass transition temperaturethereof. A material having such a linear expansion coefficient, in thistemperature range, proximate to the linear expansion coefficient of thesupport substrate is preferably used.

From another point of view, linear expansion coefficient of the basemember is preferably controlled to be proximate to the linear expansioncoefficient of the first and second electrically conductive members. Theliner expansion coefficient of the base member is preferably 0.5 to 2times as large as the liner expansion coefficient of the first andsecond electrically conductive members. The difference between thelinear expansion coefficient of the base member and that of the firstand second electrically conductive members is preferably 40% or less andmore preferably 20% or less. This suppresses a peeling off of the firstand second electrically conductive members from the base member in thedivided individual devices, and thus makes it possible to manufacture aoptical-semiconductor device having high reliability.

(First Electrically Conductive Member 101, 101′/Second ElectricallyConductive Member 102)

The first and second electrically conductive members 101, 101′ serve asa pair of electrodes for supplying electrical power to theoptical-semiconductor element. In this embodiment, the firstelectrically conductive member is electrically connected to theoptical-semiconductor element (light emitting element) by means of anelectrically conductive wire, bump or the like, and functions as anelectrode that supplies electric power from the outside. The secondelectrically conductive member functions as a support for the lightemitting element that is placed thereon, either directly or indirectlyvia another member such as sub-mount. The second electrically conductivemember 102 may simply support the light emitting element placed thereonwithout contributing to the power supply. Alternatively, the secondelectrically conductive member 102 may contribute to the power supply tothe light emitting element and protective element. In other words, thesecond electrically conductive member 102 may also function as anelectrode. In the first embodiment, the second electrically conductivemember 102 is used as a support for the light emitting element withoutcontributing to the power supply.

In this embodiment, both the first electrically conductive member andthe second electrically conductive member constitute the externalsurface at the bottom of the optical-semiconductor device (lightemitting device), in other words to be exposed to the outside (bottomsurface) without being covered by a sealing member or the like. For boththe first electrically conductive member and the second electricallyconductive member, the shape and dimensions in the top view thereof canbe appropriately determined in accordance to the size of the lightemitting device and the number and size of the light emitting elementsto be mounted on. The first electrically conductive member 101, 101′ andthe second electrically conductive member 102 preferably havesubstantially the same thickness, that is preferably in a range from 25μm to 200 μm, and more preferably from 50 μm to 100 μm. The electricallyconductive member having such a thickness is preferably formed byplating (plated layer), more preferably multiple plated layers.

(First Electrically Conductive Member 101, 101′)

In this embodiment, the first electrically conductive members 101, 101′are provided, one on each of the opposing two sides of the lightemitting device 100 that has substantially rectangular shape in top viewas shown in FIG. 1A. The first electrically conductive member 101 andthe first electrically conductive member 101′ are provided so as tointerpose the second electrically conductive member 102 via the basemember 106 therebetween. Since the second electrically conductive member102 is used to support the light emitting element without contributingto the power supply in this embodiment, two first electricallyconductive members 101, 101′ are used to serve as a pair of positive andnegative electrodes.

The first electrically conductive members 101, 101′ have top surfacesthat are electrically connected to the light emitting element 103 viathe electrically conductive wires 105, 105′ and bottom surfaces thatconstitute the external surface of the light emitting device 100. Thefirst electrically conductive members 101, 101′ are provided so as to beexposed to the outside without being covered by the base member 106.

Top surfaces of the first electrically conductive members 101, 101′ arewhere the electrically conductive wires 105, 105′ are bonded so as toestablish electrical connection with the light emitting element 103, andis required only to have an area necessary for the bonding. Top surfacesof the first electrically conductive members 101, 101′ may be eitherflat as shown in FIG. 1B, or have fine surface irregularities, grooves,pits or the like. In case the electrodes of the light emitting elementand the first electrically conductive member are electrically connecteddirectly with each other without using electrically conductive wire, thefirst electrically conductive member is provided so as to have asufficient area for bonding the electrodes of the light emitting elementthereto.

Bottom surfaces of the first electrically conductive members 101, 101′constitute the external surface of the optical-semiconductor device, andare preferably formed substantially flat, although fine surfaceirregularities may exist.

Side surfaces of both the first electrically conductive members 101,101′ may be flat. However, it is preferable that a projection X, asshown in the enlarged partial view of FIG. 1A, is formed on the sideface of the first electrically conductive member 101, 101′ to be betterattached with the base member 106. The projection X is preferablyprovided at a position located away from the bottom surfaces of thefirst electrically conductive members 101, 101′, so that such a problemcan be suppressed from occurring as the first electrically conductivemembers 101, 101′ come down off the base member 106. Instead of theprojection X, the side faces of the first electrically conductive member101, 101′ and the second electrically conductive member 102 may betilted so that the bottom surfaces of the first electrically conductivemember and the second electrically conductive member are narrower thanthe top surfaces thereof. This also suppresses these members from comingdown off.

The projection X may be provided at any position in the circumference ofthe first electrically conductive members 101, 101′, as long as it isnot on the external surface of the light emitting device 100. Forexample, the projection may be provided at selected positions such asthe opposing two sides of the electrically conductive member that hassubstantially rectangular shape in top view. In order to prevent theelectrically conductive member from coming down off more surely, it ispreferable to form the projection X along the entire circumference ofthe electrically conductive member, except for the surface thatconstitutes the external surface.

(Second Electrically Conductive Member 102)

In this embodiment, the second electrically conductive member 102 has atop surface whereon the light emitting element 103 is mounted and abottom surface that constitutes the external surface of the lightemitting device 100, as shown in FIG. 1B. Also the second electricallyconductive member 102 does not function as electrode in this embodiment.Therefore, the second electrically conductive member 102 may be disposedso that all the side faces thereof are covered by the base member 106,in other words to be located away from the side faces of the lightemitting device 100 as shown in FIG. 1A. With this structure, it can beeasily cut to produce the individual light emitting device, as thecutting edge can be prevented from touching the second electricallyconductive member 102. The second electrically conductive member 102 mayalso be disposed such that a part thereof constitutes the externalsurface of the light emitting device 100, namely so as to reach the sideface of the light emitting device 100 (not shown). Since the secondelectrically conductive member 102 has the light emitting element 103mounted thereon, heat dissipation can be improved by increasing thearea.

Top surface of the second electrically conductive member 102 is requiredto have an area at least necessary for mounting the light emittingelement 103 thereon. Besides the substantially rectangular shape in topview shown in FIG. 1A, various shapes may be employed such as polygon,corrugated shape and notched shape. The area where the light emittingelement 103 is mounted is preferably flat. The second electricallyconductive member 102 may have a protective element or the like inaddition to the light emitting element 103 mounted on the top surfacethereof.

Side surfaces of the second electrically conductive member 102 may beflat, although it is preferable that there is projection X as shown inFIG. 1B similarly to the case of the first electrically conductivemember 101, 101′, to be better attached to the base member 106. Theprojection X is preferably provided at a position located away from thebottom surface of the second electrically conductive member 102, so thatsuch a problem can be suppressed from occurring, as the secondelectrically conductive member 102 comes down off the base member 106.The projection X may be provided at any position in the circumference ofthe second electrically conductive member 102. For example, theprojection X may be provided at selected positions such as the opposingtwo sides of the second electrically conductive member 102 that hasrectangular shape in top view. In order to prevent the electricallyconductive member from coming off more surely, it is preferable to formthe projection X along the entire circumference of the secondelectrically conductive member 102.

The first electrically conductive member 101, 101′ and the secondelectrically conductive member 102 are preferably formed from the samematerial. This reduces the number of steps. But, the two members mayalso be formed from different materials. Specifically, metals such ascopper, aluminum, gold, silver, tungsten, molybdenum, iron, nickel andcobalt, or alloy of these metals (such as iron-nickel alloy), phosphorbronze, copper-clad iron, eutectic solder such as Au—Sn, solder such asSnAgCu and SnAgCuIn, ITO and the like may be used. Among solderingmaterials, such a composition is preferred as the solder and a metal tobe joined by the solder form an alloy with higher melting point afterthe solder material has melted and solidified, so that the materialwould not melt again during additional heat treatment when ref lowing.

These materials may be used either individually or in the form of alloy.Moreover, the electrically conductive member may be formed in multiplelayers of plating. In case the light emitting element, for example, itis preferable to use a material that can reflect the light from thelight emitting element 103 at least for the surface layer of theelectrically conductive member. Specifically, gold, silver, copper, Pt,Pd, Al, W, Mo, Ru, Rh or the like is preferably used. In addition, it ispreferable that the surface layer of the electrically conductive memberhas high reflectivity and high luster. Reflectivity to visible light ispreferably 70% or higher, and accordingly, such a material as Ag, Ru,Rh, Pt or Pd is preferably used. Surface luster of the electricallyconductive member is also preferably higher. Surface luster ispreferably 0.5 or higher, more preferably 1.0 or higher. The figure ofsurface luster is a value measured by means of a micro surface colordifference meter VSR 300A manufactured by NIPPON DENSHOKU INDUSTRIESCO., LTD. with irradiation angle of 45°, measuring area of 0.2 mm indiameter and perpendicular light reception. It is preferable to use, onthe support substrate side of the electrically conductive member, amaterial such as eutectic solder plating containing Au, Sn, Sn alloy,AuSn, etc. This is advantageous for mounting on a circuit board or thelike.

An intermediate layer may be formed between the surface layer (toplayer) of the electrically conductive member and the last layer on thesupport substrate side (bottom layer). In order to increase themechanical strength of the electrically conductive member and the lightemitting device, it is preferable to use a metal that has high corrosionresistance such as Ni for the intermediate layer. In order to improveheat dissipation, it is preferable to use copper for the intermediatelayer because copper has high heat conductivity. In this way it ispreferable to use a material selected for the purpose and applicationfor the intermediate layer. In addition to the metals described above,Pt, Pd, Al, W, Ru, Pd or the like may be used for the intermediatelayer. The intermediate layer may also be formed from a metal that hashigh adhesibility with the top layer and the bottom layer. Theintermediate layer is preferably thicker than the top layer and thebottom layer. Thickness of the intermediate layer is preferably in arange from 80% to 99%, more preferably from 90% to 99% of the totalthickness of the electrically conductive member.

In case the electrically conductive member is formed by plating a metal,in particular, the bottom layer and the intermediate layer arepreferably formed from materials that have linear expansion coefficientproximate to that of the support substrate since the linear expansioncoefficient is determined by the composition. In case the supportsubstrate is formed from SUS430 that has linear expansion coefficient of10.4×10⁻⁶/K, for example, the electrically conductive member formedthereon may have such a multiple layer structure that contains thefollowing metals as the main component: Au (0.04 to 0.1 μm) havinglinear expansion coefficient of 14.2×10⁻⁶/K for the bottom layer, Nihaving linear expansion coefficient of 12.8×10⁻⁶/K (or Cu having linearexpansion coefficient of 16.8×10⁻⁶/K) (25 to 100 μm) for the firstintermediate layer, Au (0.01 to 0.07 μm) for the second intermediatelayer and Ag (2 to 6 μm) having linear expansion coefficient of119.7×10⁻⁶/K for the top layer. While Ag used in the top layer has alinear expansion coefficient significantly different from those of otherlayers, Ag is used since preference is given to the reflectivity for thelight from the light emitting element. Since the top layer of Ag isformed with extremely small thickness, it has only a weak influence onthe warping, and therefore poses practically no problem.

(Sealing Member 104)

The sealing member 104 is provided for the purpose of covering the lightemitting element 103 and making contact with the first electricallyconductive member 101, 101′ and the second electrically conductivemember 102. The sealing member 104 protects the electronic componentssuch as the light emitting element 103, light receiving element, theprotective element and the electrically conductive wires 105, 105′ fromdust, moisture and external force.

The sealing member 104 is preferably formed from a material that hastransparency, for allowing the light from the light emitting element totransmit therethrough, and light resistivity to endure the light withoutdeteriorating. Specifically, insulating resin compositions that hastransparency, for allowing the light from the light emitting element totransmit therethrough, such as a silicone resin composition, a modifiedsilicone resin composition, an epoxy resin composition, a modified epoxyresin composition, an acrylic resin composition and the like may beused. Also a silicone resin, an epoxy resin, a urea resin, a fluororesinand a hybrid resin that contains at least one of these resins may beused. The material is not limited to these organic materials. Inorganicmaterial such as glass or a silica sol may also be used. In addition tothese materials, a coloring agent, a light diffusing agent, a lightreflecting material, various fillers, a wavelength converting material(a fluorescent material) or the like may also be contained as required.Quantity of the sealing member may such that can cover the electroniccomponents described above.

The sealing member 104 may be formed with various external shapesdetermined in accordance to the light distribution characteristic andother factors. The light distribution characteristic can be controlled,for example, by forming the top surface in the shape of convex lens,concave lens or Fresnel lens. Also in addition to the sealing member104, a lens member may be provided. When a molded member containing afluorescent material (such as molded sheet member containing afluorescent material or molded dome member containing a fluorescentmaterial) is used, the sealing member 104 is preferably formed from amaterial that can be readily joined with the molded member containingfluorescent material. The molded member containing fluorescent materialmay be formed from, besides a resin composition, an inorganic materialsuch as glass.

While the sealing member 104 used in the light emitting device has beendescribed, substantially the same as described above applies also to thelight receiving device. In the case of the light receiving device, awhite or black filler may be contained in the sealing member 104, forthe purpose of increasing the efficiency of receiving light and avoidsecondary reflection within the light receiving device. Also it ispreferable to use a sealing member 104 that contains black filler in aninfrared ray emitting apparatus or an infrared ray detecting apparatus,in order to avoid the interference of visible light.

(Joining Member)

A joining member is used to connect the light emitting element 103, thelight receiving element, the protective element and the like to thefirst electrically conductive member 101, 101′ and the secondelectrically conductive member 102. An electrically conductive joiningmember or an insulating joining member may be selected in accordance tothe type of substrate of the element 103 to be mounted. In the case ofoptical-semiconductor element 103 constituted by forming nitridesemiconductor layers on a sapphire substrate, for example, eitherinsulating joining member or electrically conductive joining member maybe used. When an electrically conductive substrate such as SiC is used,an electrically conductive joining member may be used to establishelectrical conductivity. For the insulating joining member, epoxy resincomposition, silicone resin composition, polyimide resin composition,modified resin thereof and hybrid resin may be used. When these resinsare used, a metal layer having high reflectivity such as Al or Ag, or areflecting film made of dielectric material may be formed on the backsurface of the light emitting element 103, to prevent deterioration frombeing caused by light and heat generated by the optical-semiconductorelement 103. In this case, such a method may be used as vapordeposition, sputtering or bonding of thin film. For the electricallyconductive joining member, an electrically conductive paste such assilver, gold or palladium, solder such as Au—Sn eutectic alloy, brazingmaterial such as low-melting point metal or the like may be used. Incase a transparent joining member, among these joining member materials,is used, it may include a fluorescent material that absorbs lightemitted by the semiconductor light emitting element and emits light ofdifferent wavelength.

(Electrically Conductive Wire 105, 105′)

The electrically conductive wires that connect the electrodes of thelight emitting element 103, the first electrically conductive member101, 101′ and the second electrically conductive member 102 with eachother may be formed from a metal such as gold, copper, platinum,aluminum or the like, or an alloy thereof. It is particularly preferableto use gold that is excellent in high heat resistance, etc.

(Wavelength Converting Member)

The sealing member may include a fluorescent material as the wavelengthconverting member that absorbs at least a part of light emitted by thesemiconductor light emitting element and emits light of differentwavelength.

Efficiency of the fluorescent material is higher when it converts thelight emitted by the semiconductor light emitting element into light ofa longer wavelength. However, the fluorescent material is not limited tothis, and various fluorescent materials may be used such as one thatconverts the light emitted by the semiconductor light emitting elementinto light of a shorter wavelength or one that converts the light thathas been converted by other fluorescent material. For the fluorescentmaterial, a single layer of one kind of fluorescent material may beformed, or a single layer of a mixture of two or more kinds offluorescent material may be formed, or two or more layers eachcontaining one kind of a fluorescent material may be formed, or two ormore layers each containing two or more kinds of a fluorescent materialmay be formed.

In case a semiconductor light emitting element having light emittinglayer formed from a nitride semiconductor is used as the light emittingelement, a fluorescent material that absorbs light emitted by the lightemitting element and emits light of different wavelength may be used.For example, nitride-based fluorescent material or oxide-nitride-basedfluorescent material activated mainly with lanthanoid element such asEu, Ce, etc. may be used. More specifically, at least one selected fromamong (a) α- or β-sialon-based fluorescent material activated with Eu,various alkaline earth metal aluminum nitride silicate fluorescentmaterials (for example, CaSiAlN₃:Eu, SrAlSi₄N₇:Eu), (b) alkaline earthmetal halogen apatite, alkaline earth metal halogen silicate, alkalineearth metal silicate, alkaline earth metal element boride halogen,alkaline earth metal element aluminate, alkaline earth element sulfide,alkaline earth element thiogalate, alkaline earth element siliconnitride or germanate activated mainly with lanthanoid element such as Euor transition metal element such as Mn, or (c) rare earth elementaluminate, rare earth element silicate or alkaline earth metal rareearth silicate activated mainly with lanthanoid element such as Ce, and(d) organic compound or organic complex activated mainly with lanthanoidelement such as Eu is preferably used. A YAG fluorescent material ispreferably used that is rare earth element aluminate fluorescentmaterial activated mainly with lanthanoid element such as Ce. YAGfluorescent materials are represented by formulas such as Y₃Al₅O₁₂: Ce,(Y_(0.8)Gd_(0.2))₃Al₅O₁₂: Ce, Y₃(Al_(0.8)Ga_(0.2))₅O₁₂: Ce, (Y, Gd)₃(Al,Ga)₅O₁₂. There also exist Tb₃Al₅O₁₂: Ce and Lu₃Al₅O₁₂: Ce formed bysubstituting a part or all of Y with Tb or Lu. Moreover, fluorescentmaterials other than those described above, having similar performance,operation and effect may also be used.

A member composed of glass or a molded body of resin composition or thelike coated with a fluorescent material may also be used. Furthermore, amolding containing fluorescent material may also be used. Specifically,a fluorescent material-containing glass, sintered YAG material, a mixedsintered material of YAG and Al₂O₃, SiO₂, or B₂O₃, a bulk of acrystallized inorganic material where YAG is precipitated in a moltenorganic material may be used. The fluorescent material may also bemolded integrally with epoxy, silicone or hybrid resin.

(Semiconductor Element)

In the present invention, the semiconductor element may have variousstructures. For example, the semiconductor element may have positive andnegative electrodes formed on the same side, or may have positive andnegative electrodes formed on different sides. Also, the semiconductorelement may have a laminated substrate that is different from afilm-growing substrate. It is preferable to use an optical-semiconductorlight emitting element (which may also be referred to simply as lightemitting element or light emitting diode) or a semiconductor lightreceiving element (which may also be referred to simply as lightreceiving element) having such a structure.

The optical-semiconductor light emitting element that operates at anydesired wavelength may be selected. For the light emitting element thatemits blue or green light, for example, ZnSe, nitride semiconductor(In_(X)Al_(Y)Ga_(1-X-Y)N, 0≦X, 0≦Y, X+Y≦1) or GaP may be used. For thelight emitting element that emits red light, GaAlAs, AlInGaP or the likemay be used. An optical-semiconductor light emitting element formed froma material other than the above may also be used. Composition, color ofemitted light, size and number of the light emitting element to be usedmay be determined in accordance to the purpose.

To make light emitting device that has fluorescent material, it ispreferable to use a nitride semiconductor (In_(X)Al_(Y)Ga_(1-X-Y)N, 0≦X,0≦Y, X+Y≦1) that is capable of emitting light of a short wavelength thatcan efficiently excite the fluorescent material. Wavelength of theemitted light can be selected by controlling the materials of thesemiconductor layer and mix proportions thereof.

A light emitting element that emits ultraviolet ray or infrared ray mayalso be used as well as visible light. Moreover, light receiving elementmay be mounted individually or together with the light emitting element.

For the light receiving element, photo IC, photodiode, phototransistor,CCD (charge-coupled device) image sensor, CMOS image sensor, Cd cell orthe like may be used.

(Support Substrate)

The support substrate (not shown in FIGS. 1A and 1B) is a member havingplate or sheet shape used for forming the first and second electricallyconductive members 101, 101′, 102 thereon. The support substrate isremoved before being divided into individual devices, and therefore doesnot exist in the final optical-semiconductor device. The supportsubstrate may be an electrically conductive metal plate such as a SUSplate, or an insulating plate such as polyimide whereon an electricallyconductive film is formed by sputtering or vapor deposition.Alternatively, a member of insulating plate whereon a thin metal film islaminated may be used. In either case, the support substrate is removedin the final stage of manufacturing. That is, the support substrate mustbe removed from the first and second electrically conductive members101, 101′, 102 and the base member 106. For this reason, it ispreferable to use the support substrate formed from a material that canbe bended, and it is preferable to use a sheet member having thicknessfrom 10 μm to 300 μm, depending on the kind of material. Preferredmaterials for the support substrate are, in addition to SUS platedescribed above, metal plates such as iron, copper, silver, kovar andnickel, and resin sheet such as one made of polyimide whereon a thinmetal film can be laminated. Particularly, it is preferable to usestainless steels having such a phase as martensite, ferrite oraustenite. Ferrite phase stainless steel is particularly preferable.Especially preferably used are 400 series and 300 series stainlesssteel. Specifically, SUS430 (10.4×10⁻⁶/K), SUS444 (10.6×10⁻⁶/K), SUS303(18.7×10⁻⁶/K), SUS304 (17.3×10⁻⁶/K) and the like are preferably used.400 series stainless steel is more easily roughened on the surface whensubjected to acid treatment conducted as a pretreatment for plating,when compared with 300 series stainless steel. Plating layer formed on400 series stainless steel that has been subjected to acid treatmentalso tends to be rough on the surface, which enables it to better hold aresin that constitutes the sealing member 104 or the base member 106. Onthe other hand, 300 series stainless steel is less likely to beroughened on the surface when subjected to acid treatment. Therefore,use of 300 series stainless steel allows it to obtain higher luster ofthe plating layer surface, leading to higher reflectivity to the lightfrom the light emitting element 103, thus resulting in light emittingdevice having higher light-extraction efficiency.

To improve the surface luster of the first and second electricallyconductive members 101, 101′, 102, the layer may be formed by plating,vapor deposition, sputtering or the like. To obtain higher luster, thesurface of the support substrate is preferably smooth. In case thesupport substrate is formed from SUS, for example, the electricallyconductive member 101, 101′, 102 having high surface luster can beformed by using 300 series SUS that has relatively small crystal grains.

The support substrate may also be provided with slit, groove, corrugatedshape or the like, in order to mitigate warping after molding the resin.

(Manufacturing Method 1-1)

The method for manufacturing the light emitting device of the presentinvention will be described by making reference to the accompanyingdrawings. FIGS. 2A through 2H are process diagrams explanatory of theprocess of manufacturing an array 1000 of the light emitting device. Theintegrated array 1000 is cut off into individual devices, so as toobtain the light emitting device 100 that has been described in thefirst embodiment.

1. First Step

First, a support substrate 1070 consisting of a metal plate or the likeas shown in FIG. 2A is prepared. Surface of the support substrate iscoated with a resist 1080 as a protective film. Thickness of the firstelectrically conductive member and the second electrically conductivemember to be formed subsequently can be controlled by the thickness ofthe resist 1080. While the resist 1080 is provided on only the topsurface (the surface whereon the first electrically conductive member,etc. are mounted) of the support substrate 1070 in this example, theresist may also be formed on the bottom surface (back surface). In thiscase, the electrically conductive member can be prevented from beingformed on the bottom surface during the plating process to be describedlater, by providing the resist over substantially the entire surface ofthe back surface.

The protective film (resist) may be either positive type or negativetype in case the resist is formed for the photolithography process.While a method using positive resist will be described here, acombination of positive type and negative type may also be employed. Theresist may also be formed by screen printing, or a resist sheet may belaminated.

After drying the resist that has been applied, a mask 1090 havingopenings is placed directly or indirectly on top of the resist, and isirradiated with ultraviolet ray as indicated by an arrow in the drawing.Wavelength of the ultraviolet ray may be determined so as to suit thesensitivity of the resist 1070 and other factors. Then the resist 1080having openings K as shown in FIG. 2B is obtained by processing with anetching solution. At this time, activation treatment with an acid mayalso be carried out.

Then the first electrically conductive member 1010 and the secondelectrically conductive member 1020 are formed in the openings K of theresist 1080 as shown in FIG. 2C through plating of a metal. At thistime, thickness of the plating may be made larger than the thickness ofthe resist 1080 by controlling the conditions of plating. Thus theelectrically conductive members are formed over the top surface of theresist (protective film) and the projections X can be formed as shown inFIG. 1A. Proper method of plating known in the prior art may be selectedin accordance to the metal to be used, or the desired thickness andflatness of the film. For example, electroplating or electroless platingmay be employed. It is particularly preferable to employ electroplatingwhich makes it easier to remove the resist (protective film) and formthe electrically conductive member in constant shape. It is alsopreferable to form an intermediate layer (from, for example, Au or Ag)by strike plating below the top layer (from, for example, Ag) in orderto improve adherence with the top layer.

After plating, the protective film 1080 is washed and removed, so thatthe first electrically conductive member 1010 and the secondelectrically conductive member 1020 that are separated from each otherare formed as shown in FIG. 2D. The projection X may also be formed bycrushing, or baking after printing of metallic paste, besides theplating process described above.

2. Second Step

Then the base member 1060 that can reflect light from the light emittingelement is provided between the first electrically conductive member1010 and the second electrically conductive member 1020, as shown inFIG. 2E. The base member may be formed by any proper method such asinjection molding, transfer molding or compression molding.

In case the base member 1060 is formed by transfer molding, for example,the support substrate having a plurality of the first and secondelectrically conductive members 1010, 1020 is set in a mold so as to beinterposed between an upper mold and a lower mold. At this time, thesubstrate 1070 may be set in the mold via mold release paper. The moldis filled with resin pellets as the raw material of the base member, andthe support substrate 1070 and the resin pellets are heated. The resinpellets are melted and pressurized so as to fill in the space in themold. Heating temperature, heating time and pressure can be determinedin accordance to the composition of the resin in use. After being cured,the molding shown in FIG. 2E is taken out of the mold.

3. Third Step

Then the light emitting element 1030 is bonded onto the secondelectrically conductive member 1020 by a joining member (not shown) asshown in FIG. 2F, and is connected via the electrically conductive wire1050 to the first electrically conductive member 1010. While the lightemitting element 1030 that has positive and negative electrodes on thesame side thereof is used in this example, a light emitting element thathas positive and negative electrodes on different sides thereof may alsobe used.

4. Fourth Step

Then the sealing member 1040 is formed so as to cover the light emittingelement 1030 and the electrically conductive wire 1050 by transfermolding, potting, printing or other method. While the sealing member isformed in a single layer structure in this example, it may also beformed in multiple layers that have different compositions orproperties. After curing the sealing member 1040, the support substrate1070 is removed as shown in FIG. 2G.

5. Fifth Step

The array 1000 of the semiconductor device (light emitting device) asshown in FIG. 2G is obtained through the steps described above. Lastly,the array 1000 is cut off along dashed line shown in FIG. 2H so as to beseparated into individual devices. Thus, the light emitting device 100shown, for example, in FIG. 1A is obtained. Various methods may beemployed for dividing into individual devices, such as dicing by meansof a blade, dicing by laser beam, etc.

FIG. 2H shows an operation of cutting through the electricallyconductive member, although the present invention is not limited tothis, and the cutting position may be offset from the electricallyconductive member. Cutting through the electrically conductive membermakes it easier to bond with solder as the electrically conductivemember is exposed also on the side face of the optical-semiconductordevice. When the cutting position is apart from the electricallyconductive member, on the other hand, what is cut off is only resin suchas the base member 1060 and the sealing member 1040, and therefore it iseasier to cut than in the case of cutting the electrically conductivemember (metal) and the resin together.

(Manufacturing Method 1-2)

Now manufacturing method 1-2 wherein the first electrically conductivemember 1010 and the second electrically conductive member 1020 areformed by etching will be described.

A thin film of electrically conductive member such as copper foil islaminated on the support substrate 1070 of plate shape formed from aninsulating material such as polyimide. A protective film (dry resistsheet, etc.) of sheet shape is laminated onto the electricallyconductive member, and is exposed to light via a mask that has openings,and the protective film in the portion exposed to light is removed byusing a washing liquid such as weak alkaline solution. This leaves theprotective film having openings being formed on the electricallyconductive member.

Then the support substrate 1070 is immersed in an etching solution thatis capable of etching the electrically conductive member, so as to etchthe electrically conductive member. Lastly, the protective film isremoved so that the first electrically conductive member 1010 and thesecond electrically conductive member 1020 located away from each otherare formed on the support substrate 1070.

Embodiment 2

An optical-semiconductor device (light emitting device) 200 according tothe second embodiment is shown in FIG. 3A and FIG. 3B. FIG. 3A is aperspective view showing the inside of the light emitting device 200 ofthe present invention, and FIG. 3B shows a sectional view taken alonglines B-B′ of the light emitting device 200 shown in FIG. 3A with arecess thereof being sealed.

The light emitting device 200 of the second embodiment comprises (a) alight emitting element 203 and a protective element 210, (b) a firstelectrically conductive member 201 electrically connected to the lightemitting element 203 and to the protective element 210, (c) a secondelectrically conductive member 202 that is disposed separately from thefirst electrically conductive member 201 and has the light emittingelement 203 mounted thereon, and (d) a sealing member 204 that coversthe light emitting element 203 and contacts with the first electricallyconductive member 201 and with the second electrically conductive member202. The first electrically conductive member 201 and the secondelectrically conductive member 202 constitute, by the bottom surfacesthereof, the external surface of the light emitting device 200. Part ofthe side faces of the first electrically conductive member 201 and thesecond electrically conductive member 202 also constitute the externalsurface of the light emitting device 200. A base member 206 formed froma resin capable of blocking the light emitted by the light emittingelement 203 is provided between the first electrically conductive member201 and the second electrically conductive member 202. The base member206 has a bottom portion between the first electrically conductivemember 201 and the second electrically conductive member 202 and aprotruding portion 206 b that rises higher than the top surfaces of thefirst electrically conductive member 201 and the second electricallyconductive member 202, at a position apart from the light emittingelement 203. Thus the protruding portion 206 b of the base member 206constitutes a recess S1 in the light emitting device 200. The recess S1makes it possible to suppress light from being emitted toward the sideface of the light emitting device 200 and emit the light toward the topsurface.

It is preferable that the protruding portion 206 b has inclined innersurface so as to form the recess S1 that flares toward the top as shownin FIG. 3B. This configuration makes it easier to reflect the light inthe direction toward above the light emitting device. The members usedin the second embodiment may be similar to those of the firstembodiment.

(Manufacturing Method 2)

The manufacturing method for the light emitting device 200 will bedescribed with reference to the accompanying drawings. FIGS. 4A through4D are a diagram explanatory of a step of forming an aggregate 2000 ofthe light emitting device. The light emitting device 200 described inthe second embodiment is obtained by cutting off the aggregate 2000.

1. First Step

The first step of the manufacturing method 2 can be carried outsimilarly to the manufacturing method 1-1 and manufacturing method 1-2.

2. Second Step

In the second step, a protruding portion 2060 b is formed at the sametime as a bottom portion 2060 a of the base member is formed in thesecond step as shown in FIG. 4A. While the protruding portion 2060 b andthe bottom portion 2060 a are formed at the same time in this example,the protruding portion 2060 b may be formed after forming the bottomportion 2060 a, or the protruding portion 2060 b may be formed first,followed by the formation of the bottom portion 2060 a. While theprotruding portion 2060 b and the bottom portion 2060 a are preferablyformed from the same light blocking resin, they may also be formed fromdifferent light blocking resins depending on the purpose andapplication.

The protruding portion 2060 b can be formed by transfer molding processor the like using a mold, similarly to the bottom portion 2060 a of thebase member. The protruding portion 2060 b as shown in FIG. 4A can beformed by using an upper mold that has a recess.

3. Third Step

In the third step, the light emitting element 2030 is placed on thefirst electrically conductive member 2010 in a region surrounded by theprotruding portion 2060 b as shown in FIG. 4B. The electricallyconductive wires 2050 are connected to the top surfaces of the first andsecond electrically conductive members in the region surrounded by thesame protruding portion 2060 b

4. Fourth Step

In the fourth step, the recess formed by the surrounding protrudingportion 2060 b is filled with the sealing member formed from thetranslucent resin as shown in FIG. 4C so that the light emitting elementis covered by the sealing member. While the sealing member 2040 isprovided to a height substantially the same as the height of theprotruding portion 2060 b in this example, the present invention is notlimited to this, and the sealing member may be either lower or higherthan the protruding portion 2060 b. The sealing member 2040 may alsohave flat top surface as in this example, or may have a curved surfacewith the middle recessed or protruding.

5. Fifth Step

In the fifth step, the array is cut along the dashed line shown in FIG.4D, namely at such a position that cuts the protruding portion 2060 b,to divide into individual devices to obtain the optical-semiconductordevice 200 shown in FIG. 3A. In the example illustrated, the array iscut at a position where the protruding portion 2060 b is cut but thesealing member 2040 is not cut. Therefore, in the obtained device, thelight direction can be restricted to the upward direction of theoptical-semiconductor device (light emitting device) 200. In this way,light-extraction efficiency in the upward direction can be improved.While the protruding portion 2060 is cut off in this example, cuttingoperation may also be done at a position where the sealing member 2040is cut.

Embodiment 3

FIG. 5 is a perspective view showing the optical-semiconductor device ofthe present invention, with a part thereof being cut away to reveal theinside of a base member 306. In the third embodiment, a light emittingelement 303 is mounted in a recess S2 that is surrounded by theprotruding portion 306 of the base member, and a protective element 310is embedded in the protruding portion 306 of the base member, as shownin FIG. 5. FIG. 5 is a diagram showing the inside of a part of the basemember 306 of the optical-semiconductor device that has substantiallyrectangular parallelepiped shape as shown in FIG. 3A.

In the second step, before forming the base member, the protectiveelement 310 is placed on the second electrically conductive member 302and is connected to the first electrically conductive member 301 bymeans of the electrically conductive wire 305. Thus such a structure canbe made as the protective element 310 is embedded in the base member306. In the first embodiment, the light emitting element and theprotective element are mounted in the third step, after forming the basemember in the second step. In this embodiment, the light emittingelement and the protective element are provided in different steps. Theoptical-semiconductor device can be made more compact by providing theprotective element so as to be embedded in the base member as in thisembodiment.

Embodiment 4

FIG. 6A is a perspective view showing the optical-semiconductor deviceof this embodiment, and FIG. 6B is a sectional view taken along linesC-C′ in FIG. 6A. In the fourth embodiment, a base member 406 is providedso as to reach the side face of light emitting element 403, as shown inFIG. 6A and FIG. 6B. In this embodiment, the protruding portion thatrises above the top surfaces of the first electrically conductive memberand the second electrically conductive member is provided across theentire base member 406. Such a constitution can be obtained by carryingout the third step, namely the step of mounting theoptical-semiconductor element on the first and/or second electricallyconductive member, prior to the second step, namely the step ofproviding the base member formed from light blocking resin between thefirst and second electrically conductive members. Since the base member406 is provided to a height substantially the same as the height of theoptical-semiconductor element (light emitting element) 403 as shown inFIG. 6A and FIG. 6B, light is emitted only through the top surface ofthe light emitting element. This constitution makes it possible toextract light more efficiently.

While the base member (protruding portion) 406 is provided to a heightsubstantially the same as the height of the light emitting element 403in this embodiment, the base member 406 may be provided to be lower thanthe light emitting element 403. When the base member 406 as describedabove is provided, the sealing member 404 may be dripped or printed andcured on the light emitting element 403 and on the base member 406. Sucha method may also be employed as the sealing member 404 that has beenformed and cured in another step is bonded onto the base member 406 andthe light emitting element 403. For example, the sealing member 404formed by molding Al₂O₃ powder and YAG fluorescent material powder in ashape of flat plate by compression molding or the like may be bondedonto the light emitting element 403 or the base member 406 by using anadhesive.

In the fourth embodiment, positive and negative electrodes of the lightemitting element 403 are directly connected to the first and secondelectrically conductive members by means of an electrically conductivejoining member, without using electrically conductive wire. In case theoptical-semiconductor element 403 is mounted before the base member 406is formed, a trouble of wire deformation during a molding can be avoidedby connecting without a wire, as described above.

Embodiment 5

FIG. 7A is a sectional view showing the optical-semiconductor device ofthis embodiment, and FIG. 7B is a partially enlarged view of FIG. 7A.The optical-semiconductor device of the fifth embodiment has an exteriorsimilar to that of the optical-semiconductor device shown in FIG. 3A. Arecess is formed by the protruding portion 506 b serving as side wallsurrounding the light emitting element 503. In this recess, the basemember 506 has a bottom portion 506 a that is lower than the protrudingportion 506 b serving as the side wall of the recess. However, theoptical semiconductor device is different from that in FIG. 3A in thatthe top surface of the bottom portion 506 a is higher than the topsurfaces of the first electrically conductive member 501 and the secondelectrically conductive member 502. Also, a projection Y is formed inthe bottom portion 506 a of the base member 506 so as to cover a part ofthe top surfaces of the first electrically conductive member 501 and ofthe second electrically conductive member 502, as shown in FIG. 7B. Withthis constitution, the bottom portion 506 a of the base member 506 canbe suppressed from coming down off when the support substrate is removedduring the manufacturing process. Also because the bottom portion 506 aof the base member 506 can be made thicker at a position near the lightemitting element 503, the light emitted by the light emitting element503 can be suppressed from leaking through the bottom portion, andtherefore light can be reflected more efficiently. The bottom portion506 a of the base member 506, including projection Y is preferablyformed to such a height as the electrically conductive wire 505 does nottouch therewith. While it is preferable to cover a part of the topsurfaces of both the first electrically conductive member 501 and thesecond electrically conductive member 502, it suffices to cover only oneof these members. Size, position and other parameters of the region tobe covered may be determined as required. Moreover, instead of providingthe base member 506 between the first electrically conductive member 501and the second electrically conductive member 502, a sub-mount formedfrom Si or the like, on which the light emitting element is mounted, maybe disposed to straddle the first electrically conductive member 501 andthe second electrically conductive member 502. This constitution makesit possible to suppress the light emitted by the light emitting element503 from leaking through the bottom surface, and therefore light can bereflected more efficiently.

According to the method of manufacturing the optical-semiconductordevice described above, the optical-semiconductor device that is compactand light in weight, and has high light-extraction efficiency and highcontrast can be manufactured easily. The optical-semiconductor devicecan be used in (a) various display apparatuses, (b) illuminationapparatus, (c) display, (d) backlight source for liquid crystal display,(e) image capturing apparatus for digital video camera, facsimile,copying machine, scanner, etc., (f) projector and the like.

1. A method for manufacturing an optical-semiconductor device, comprising: forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate having a plate shape; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin, wherein said translucent resin lets more light from the optical-semiconductor element go through than said light blocking resin; and obtaining individual optical-semiconductor devices after removing the support substrate, by cutting at a position that includes the first and second electrically conductive members.
 2. The method for manufacturing the optical-semiconductor device according to claim 1, wherein the first and second electrically conductive members are formed by plating.
 3. The method for manufacturing the optical-semiconductor device according to claim 1, wherein forming the plurality of first and second electrically conductive members includes: forming an electrically conductive member on the support substrate; and etching the electrically conductive member so as to form the first and second electrically conductive members that are separated from each other.
 4. The method for manufacturing the optical-semiconductor device according to claim 1, wherein the base member has a protruding portion that protrudes above the top surfaces of the first and second electrically conductive members.
 5. The method for manufacturing the optical-semiconductor device according to claim 1, wherein obtaining individual optical-semiconductor devices further comprises: cutting at a position that is apart from the first and second electrically conductive members.
 6. The method for manufacturing the optical-semiconductor device according to claim 1, wherein a difference in the linear expansion coefficient of the support substrate from the linear expansion coefficient of the base member is 30% or less.
 7. A method for manufacturing an optical-semiconductor device, comprising: forming a plurality of first and second electrically conductive members that are disposed separately from each other on a support substrate having a plate shape; providing a base member formed from a light blocking resin between the first and second electrically conductive members; mounting an optical-semiconductor element on the first and/or second electrically conductive member; covering the optical-semiconductor element by a sealing member formed from a translucent resin, wherein said translucent resin lets more light from the optical-semiconductor element go through than said light blocking resin; and obtaining individual optical-semiconductor devices after removing the support substrate, wherein forming the plurality of first and second electrically conductive members includes: forming a protective film, that has openings which are located away from each other, on the support substrate; and forming the first and second electrically conductive members in the openings.
 8. The method for manufacturing the optical-semiconductor device according to claim 7, wherein obtaining individual optical-semiconductor devices by cutting at a position that includes the first and second electrically conductive members.
 9. The method for manufacturing the optical-semiconductor device according to claim 7, wherein the first and second electrically conductive members are formed by plating.
 10. The method for manufacturing the optical-semiconductor device according to claim 7, wherein the base member has a protruding portion that protrudes above the top surfaces of the first and second electrically conductive members.
 11. The method for manufacturing the optical-semiconductor device according to claim 7, wherein obtaining individual optical-semiconductor devices by cutting at a position that is apart from the first and second electrically conductive members.
 12. The method for manufacturing the optical-semiconductor device according to claim 7, wherein a difference in the linear expansion coefficient of the support substrate from the linear expansion coefficient of the base member is 30% or less. 